Encapsulation

Used principally in the electrical and electronic industries, encapsulation is the process of protecting components such as integrated circuits, sensors, transponders and other associated assemblies from moisture, corrosion or vibration by encapsulating them with a two component epoxy resin, polyurethane, silicone or other similar material.

DOPAG metering and mixing systems suitable for dispensing these materials for encapsulation applications include ECONO-MIX, MICRO-MIX, SILCO-MIX and VARIO-MIX piston pump systems along with ELDO-MIX gear pump type systems.

Normally, metered shots of encapsulant are dispensed into the assembly that requires encapsulation, via a DOPAG twin valve, either manually or automatically.

 

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